Researchers at Kanazawa University, in collaboration with Diamond and Carbon Applications (Germany), have developed a ...

Deep reactive ion etching (DRIE) is a highly anisotropic plasma etching process that creates deep, near-vertical features in silicon and related microfabrication materials. DRIE extends ordinary ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...

A team of physicists has uncovered some of the physics that make possible the etching of silicon computer chips, which power cell phones, computers, and a huge range of electronic devices. Physicist ...

Development of next-generation power devices is needed for energy saving in a low carbon society. Diamond is a potentially important power device material due to its excellent physical and electronic ...