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Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modules
However, 3.5D XDSiP's F2F HCB is likely a proprietary implementation of TSMC's bumpless SoIC-X stacking technology, albeit with Broadcom's proprietary design and automation flow (which is ...
The Star8d
Hextar Capital positive about expansion drive
PETALING JAYA: Hextar Capital Bhd (HCB) is optimistic that its expansion into the construction business will reap benefits in the near future. Chairman Datuk Mazlin Md Junid said: “While our ...