Semiconductor Engineering

Testing Devices In Module Packages And Designing Cryogenic Current Sensors For All-Electric Aircraft

A technical paper titled “Characterizing semiconductor devices for all-electric aircraft” was published by researchers at University of Strathclyde (Glasgow) and Airbus UpNext. “Cryogenic propulsion ...
Semiconductor Engineering

Module Testing Adds New Challenges

System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...
Business Wire

Teradyne Introduces New Test System for the Power Semiconductor Industry

NORTH READING, Mass.--(BUSINESS WIRE)--Teradyne, Inc. (NYSE:TER) introduces the ETS-88TH, the latest addition to the ETS-88 product line designed to test IGBT, MOSFET, and power module devices. The ...
Electronic Design

MicReD power tester targets electric and hybrid vehicle IGBT thermal reliability

Wilsonville, OR. Mentor Graphics today announced a new MicReD Power Tester 600A product, which tests electric and hybrid vehicle (EV/HEV) power electronics reliability during power cycling. The MicReD ...
Electronic Design

IGBT/SiC Module Drivers Target Traction Inverters for EV, HEV, Fuel-Cell Vehicles

At PCIM Europe, Power Integrations announced the SCALE EV family of gate-driver boards for Infineon EconoDUAL modules. The SCALE EV family consists of automotive-qualified, dual-channel plug-and-play ...