This article discusses a new technique of coupling thermogravimetry to GC in order to automate the event-controlled or continuous characterization of gas emissions from biomass during thermal ...

Assessing individual components is the foremost step in system thermal analysis. A component's reported thermal-resistance data becomes the gauge for thermal evaluation and management. It is therefore ...

Rising chip and packaging complexity is causing a proportionate increase in thermal couplings, which can reduce performance, shorten the lifespan of chips, and impact overall reliability of chips and ...

Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power ...

Have you ever wondered what journey a piece of equipment or machinery took before ending up in space? Or what testing was done before the rocket’s blastoff? Or why a piece of equipment failed ...

Should you have feedback on this article, please complete the fields below. Please indicate if your feedback is in the form of a letter to the editor that you wish to have published. If so, please be ...