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This was my process to retain Arcane's stylised shapes and painterly textures.

Abstract: Three dimensional stacked integrated circuits (3D ICs) are extremely attractive for overcoming the barriers in interconnect scaling, offering an opportunity to continue the CMOS performance ...

Abstract: This paper presents a comprehensive TCAD (Technology Computer-Aided Design) modelling study focused on multi-channel Gallium Nitride (GaN) devices, with a particular emphasis on tri-gate ...