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Abstract: Elelctrochemical migration (ECM) test was conducted for fine pitch flip-chip micro bump interconnect. Two kinds of micro bump. i. e., Cu post with SnAg solder and Cu under bump metallization ...

Abstract: The encapsulation of chips with fine pitch micro bump interconnections in chip-to-wafer (C2W) bonding has a known two steps process in wafer level packaging. First step is underfilling ...

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