Abstract: Increased functional density and reduced input/output (I/O) spacing are the market trends in the electronics manufacturing industry. Industry reports indicate that approximately 50%-70% of ...

Senseair, Swedish subsidiary of Asahi Kasei Microdevices, has developed the “S12 CO 2 ” as a next-generation CO 2 sensor for demand-controlled ventilation (DCV) in zero-energy buildings ...

WEP 992D-III 2-in-1 Soldering Station and Hot Air Rework Station - High-Power Soldering Iron Kit with C245-compatible Cartridge, 1000W Hot Air BGA Rework Station for SMD, IC Repair Guangzhou Yihua ...

In context: The Raspberry Pi Foundation's latest release, the Pi 500 Keyboard PC, integrates the powerful Raspberry Pi 5 into a sleek, compact keyboard design. The innovative form factor positions the ...

In the surface assembly process of electronic products, especially in the high-volume reflow soldering process, the tombstone effect of passive chip components to the PCBA assembly soldering adds a ...

Abstract: Ultrathin bare die chips and small-size surface mount device components were successfully soldered using a novel roll-to-roll compatible soldering technology. A high-power xenon light flash ...

Thanks to Apple’s move to its own chips, the Mac has been on a roll recently, after a frustrating spell of bad keyboards, poor ports, and overheating with pre-M1 Macs. But not all of those old Macs ...