How atomic-layer deposition and hybrid dielectrics are redefining reliability and scaling for AI-era semiconductors.

Abstract: One of the key processes of 3-D IC technology is the implementation of a temporary bonding solution that gives the ability to handle and process thinned Si wafers. Figure 1 depicts thin ...

Scientists developed flexible optoelectronic device using low-temperature process with minimized thin-film defects via hydrogen dilution control. (Nanowerk News) Dr. Jung-Dae Kwon's research team at ...

Dr. Jung-Dae Kwon's research team at the Energy & Environmental Materials Research Division of the Korea Institute of Materials Science (KIMS, President Chul-Jin Choi) has successfully developed an ...

Dr. Jung-Dae Kwon's research team at the Energy & Environmental Materials Research Division of the Korea Institute of Materials Science (KIMS) has successfully developed an amorphous silicon ...

German automation specialist Acp systems developed an advanced robotics solution integrating image processing to handle a range of wafer sizes and tolerances within a vapor deposition process for a ...

French start-up Fairmat recently announced a new round of funding to support the industrial scale-up of its solutions. Last January, at JEC World 2025, it unveiled two major innovations: FairPly, a ...

A Hollow Cathode Plasma Enhanced Chemical Vapor Deposition (HC-PECVD) reactor was used to deposit silver doped Diamond-Like Carbon (Ag-DLC) films on Ti6Al4V alloy employing two methodologies: i) ...