Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry. Amid ongoing memory ...
TAIPEI (Taiwan News) — Powertech Technology Chair Tsai Tu-kung (蔡篤恭) said Monday that memory shortages are likely to persist as AI demand accelerates.
As of January 29, combined market cap of 90 listed CPSEs (including 12 PSBs) stood at Rs 66.6 lakh crore, accounting for 14.5 ...
The Economic Survey 2026 noted that receipts from asset and equity monetisation are an important component of the Government’s non-debt capital receipts. During FY26 (up to 31 December 2025), the ...
Powertech Technology (PTI) saw improvements in profit margin, gross margin, and operating margin in 4Q25 and expects 1Q26 to ...
Over the last 5 years, the share price of Lakshya Powertech has declined 20.13% CAGR. Over the past year, the corresponding return has been -58.17%. Lakshya Powertech’s current P/E of 7.72x helps give ...
EDGE’s Platforms & Systems cluster is behind some of the group’s leading products and brands and is central to its partnerships and organic expansion, says its president Khaled Al Zaabi From armed ...
Taiwan Semiconductor Manufacturing Company's growth hasn't slowed. AI demand is outpacing packaging capacity, creating an industry bottleneck. Here's why Powertech, ASE, and Intel matter next. When ...
SK keyfoundry said on the 12th that it has established a dedicated unit to provide customer-specific silicon carbide (SiC) solutions. The company set the target timing to start its SiC-based power ...
Chip packaging service provider Powertech Technology Inc (力成科技) plans to more than double its capital expenditures next year to more than NT$40 billion (US$1.31 billion) as demand for its new ...
Chanakya Opportunities Fund I leads investment with over 15% stake in the round. Polite Powertech specializes in turnkey EPC projects and has laid 4,000+ km of transmission lines. Investment supports ...
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing.