Abstract: Increased functional density and reduced input/output (I/O) spacing are the market trends in the electronics manufacturing industry. Industry reports indicate that approximately 50%-70% of ...

Senseair, Swedish subsidiary of Asahi Kasei Microdevices, has developed the “S12 CO 2 ” as a next-generation CO 2 sensor for demand-controlled ventilation (DCV) in zero-energy buildings ...

WEP 992D-III 2-in-1 Soldering Station and Hot Air Rework Station - High-Power Soldering Iron Kit with C245-compatible Cartridge, 1000W Hot Air BGA Rework Station for SMD, IC Repair Guangzhou Yihua ...

In context: The Raspberry Pi Foundation's latest release, the Pi 500 Keyboard PC, integrates the powerful Raspberry Pi 5 into a sleek, compact keyboard design. The innovative form factor positions the ...

In the surface assembly process of electronic products, especially in the high-volume reflow soldering process, the tombstone effect of passive chip components to the PCBA assembly soldering adds a ...

Abstract: Ultrathin bare die chips and small-size surface mount device components were successfully soldered using a novel roll-to-roll compatible soldering technology. A high-power xenon light flash ...

Apple's Unified Memory Architecture first brought changes to the Mac with Apple Silicon M1 chips. There are clear architectural benefits for the hardware — and it is both good and bad for consumers.

Thanks to Apple’s move to its own chips, the Mac has been on a roll recently, after a frustrating spell of bad keyboards, poor ports, and overheating with pre-M1 Macs. But not all of those old Macs ...

In our previous article on Ball Grid Arrays (BGAs), we explored how to design circuit boards and how to route the signals coming out of a BGA package. But designing a board is one thing – soldering ...